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The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the connectorized S package mixer used with a +20 dBm sine wave LO. Specifications shown for configuration A (B).

Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually inspected.

Parameter

Test Conditions

Min

Typical

Max

Units

RF (Port 3) Frequency Range

 

1.5

 

13

GHz

LO (Port 1) Frequency Range

 

1.5

 

13

I (Port 2) Frequency Range

 

0.25

 

5

Conversion Loss (CL)[1]

RF/LO = 1.5 - 13 GHz

I = 0.75 GHz

 

8.5

(10)

11.5

(13)

dB

RF/LO = 1.5 - 13 GHz

I = 0.25- 0.75 GHz

 

10.5

(11)

 

RF/LO = 1.5 - 13 GHz

I = 0.75- 5 GHz

 

9.5

(11)

 

Noise Figure (NF)[2]

RF/LO = 1.5 - 13 GHz

I = 0.75 GHz

 

8.5

 

dB

Isolation

LO to RF

RF/LO = 1.5 - 13 GHz

 

43

 

dB

LO to IF

IF/LO = 1.5 - 13 GHz

 

41

 

RF to IF

RF/IF = 1.5 - 13 GHz

 

39

 

Input IP3 (IIP3)[3]

RF/LO = 1.5 - 13 GHz

I = 0.75 GHz

 

+31

(+31)

 

dBm

Input 1 dB Gain Compression Point (P1dB)[4]

 

 

+20

(+20)

 

dBm



[1] Measured as a down converter to a fixed 750 MHz IF. Unless otherwise stated, frequency conversion done using a highside LO.

[2] Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater than 5 MHz.

[3] IP3 depends on LO drive condition. Reported table value is measured with a square wave LO formed using 2x ADM1-0026PA in series with +10 dBm input into the first stage. LO Power reported in plots is of the fundamental tone only. Square wave LO power in plots is stepped down using broadband DC-40 GHz attenuators.

[4] P1dB is measured using a +23 dBm square wave LO.

Download our 3D models here.
MT3L-0113H Mixer Package Diagram

The MT3L-0113H is a GaAs MMIC triple balanced mixer with high dynamic range and low conversion loss. This mixer belongs to the T3 family which offers high IP3, P1dB, and broad operating bandwidths for applications in the S, C and X bands. MT3L-0113H is the monolithic cousin of the MT3-0113HCQG and sister of the MT3H-0113HCH targeted towards lower IF applications in a small footprint. The MT3L-0113H is available as both wire bondable die and a connectorized module.

ModelPackage StyleOrder
MT3L-0113HSConnectorized (S)Buy Now
MT3L-0113HCH-2Chip (CH)Buy Now


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