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The MQS-0218 is a MMIC 2GHz – 18GHz 90° splitter/combiner. Wire bondable 50Ω terminations are available on-chip. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional splitter/combiner technologies. The MQS-0218 is available as a wire bondable chip and connectorized module. Low variation allows for accurate simulations using the provided S4P file taken from measured production units. Applications include single sideband upconverters, image rejection downconverters, IQ modulators, balanced amplifiers, and microwave correlators. The MQS-0218 is not recommended for applications involving reflected signals.

The electrical specifications apply at TA=+25°C in a 50Ω system.

Min and Max limits are guaranteed at TA=+25°C.

Bare Die

Parameter

Frequency (GHz)

Min

Typ.

Max

Units

Coupling

2-18

 

3

 

dB

Nominal Phase Shift

 

90

 

Degrees

Amplitude Balance

2-3

 

±2

 

dB

3-18

 

±1

±4

Phase Balance

2-17

 

±3

±7

Degrees

17-18

 

±5

 

Excess Through Line Insertion Loss

2-18

 

1.4

4.2

dB

Isolation

9

17

 

dB

VSWR

 

1.25

 

 

Impedance

 

50

 

Ω

 

Connectorized Module

Parameter

Frequency (GHz)

Min

Typ.

Max

Units

Coupling

2-18

 

3

 

dB

Nominal Phase Shift

 

90

 

Degrees

Amplitude Balance

2-3

 

±2

 

dB

3-18

 

±1

±5

Phase Balance

2-17

 

±3

±12

Degrees

17-18

 

±6

 

Excess Through Line Insertion Loss

2-18

 

1.4

4.2

dB

Isolation

8.5

18

 

dB

VSWR

 

1.17

 

 

Impedance

 

50

 

Ω

Download our 3D models here.
MQS-0218 Hybrid Package Diagram

Model

Stock

Price


ModelPackage
MQS-0218CHChip (CH)
MQS-0218UAConnectorized (UA)

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