The MBAL-1440 is a MMIC isolation balun. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional balun technologies. The MBAL-1440 is available as a wire bondable chip. Low unit to unit variation allow for accurate simulations using the provided S3P file taken from measured production units.

Product Status: Released