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We are going to wire the pads on the top of the mixer over to another board/sub-board, possibly across a 2-3 mil cavity. I am trying to find out what shape and dimensions the pads need to be on the other end from the part itself that we are tieing them to. Do you have that information?

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We have no idea what size pads they should be, since it depends on your substrate. The pads should be for 50 ohm lines, so whatever width makes a 50 ohm line in your system is the appropriate pad size.

Other tips:

  1. Limit bond wire inductance. Internally, we almost always use 3 wire bonds per I/O port. We try to keep the bond wire loop short, and the length short.
  2. Try and make sure the top surface of the PCB and the top surface of the chip are flush. Vertical transition up or down from the chip can also cause performance degradation

For more information, see this blog post:

Microlithic Die Attach

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