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Description

The MBAL-1440 is a MMIC Isolation balun. It features Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit to unit variation than traditional balun technologies. The MBAL-1440 is available as a wire bondable chip. Low unit to unit variation allow for accurate simulations using the provided S3P file taken from measured production units. Applications include analog to digital converters, balanced amplifiers, baseband digital modulation, and signal integrity.

Specifications

Electrical Specifications

The electrical specifications apply at TA=+25°C in a 50Ω system.
Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually inspected.

Parameter

Frequency (GHz)

Min

Typ.

Max

Units

Nominal Insertion Loss

14-40

 

3

 

dB

Nominal Phase Shift

 

180

 

Degrees

Amplitude Balance

 

±0.2

±0.8

dB

Phase Balance

 

±1.1

±8.5

Degrees

Excess Insertion Loss

 

1.5

5.0

dB

Common Mode Rejection

19

35

 

dB

Isolation

7.5

13

 

dB

VSWR

 

1.8

 

 

Impedance

 

 

50

 

Ω

Packages

Download our 3D models here.
MBAL-1440CH Balun Package Diagram
BAL-SMT Broadband Balun image

Model

Stock

Price


Volume Pricing

ModelPackage
MBAL-1440CHChip (CH)


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